積層回路基板装置 - Yazaki Corporation

Title:

積層回路基板装置

Document Type and Number:

Japanese Patent JP7193510

Kind Code:

B2

Abstract:

A circuit pattern of a power line and a circuit pattern of a signal line are disposed in a first layer 10a of a laminated circuit board device 10, a circuit pattern of the signal line to be protected is disposed in a second layer 10b, and a circuit pattern of a power line is disposed in a third layer 10c. The shapes of the first circuit pattern of the power line of the first layer 10a and the second circuit pattern of the power line of the third layer 10c are substantially matched with each other with respect to a portion of the second layer 10b facing the circuit pattern of the signal line. The direction of the current i2a of the first circuit pattern coincides with the direction of the current i2b of the second circuit pattern. The electromagnetic induction caused by the change of the current i2a and the electromagnetic induction caused by the change of the current i2b are canceled out at the position of the signal line circuit pattern of the second layer 10b at the center.

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Inventors:

Tsunehiro Watanabe

Application Number:

JP2020162414A

Publication Date:

December 20, 2022

Filing Date:

September 28, 2020

Export Citation:

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