Title:
接続材料
Document Type and Number:
Japanese Patent JP7193512
Kind Code:
B2
Abstract:
To provide a connection material which can achieve a low connection resistance value.SOLUTION: A connection material includes: resin particles; a first conductive coating which covers the resin particles; a plurality of protruding core materials, each having Vickers hardness of 1,500 to 5,000, which are arranged on the first conductive coating; and a conductive particles having a second conductive coating which covers the first conductive coating and the protruding core materials. The lowest molten viscosity of the connection material ranges 1 to 100,000 Pa s. As a result, a binder between the conductive particles and an electrode may be sufficiently removed and sufficient pressure can be applied to the electrode, thereby making it possible to achieve a low connection resistance value.SELECTED DRAWING: Figure 1
Inventors:
Tatsuro Fukaya
Tomoyuki Ishimatsu
Tomoyuki Ishimatsu
Application Number:
JP2020169531A
Publication Date:
December 20, 2022
Filing Date:
October 07, 2020
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H01B1/22; H01B1/00; H01R11/01
Domestic Patent References:
| JP2015057757A | ||||
| JP2011175846A | ||||
| JP2014207224A |
Foreign References:
| WO2012098929A1 | ||||
| WO2009057612A1 |
Attorney, Agent or Firm:
Nobuhiro Noguchi