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Patent Searching and Data


Title:
樹脂、硬化性樹脂組成物及び硬化膜
Document Type and Number:
Japanese Patent JP7329309
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin that is useful as a binder resin of a curable resin composition, which has excellent solvent resistance, and can form a cured film having excellent solvent resistance and adhesion even when the temperature in a post-baking step is 200°C or less.SOLUTION: A resin has a constitutional unit having an α,β-unsaturated carbonyl group (Aa), a constitutional unit having an active methylene group or active methine group (Ab), and a constitutional unit having an acid radical (Ac).SELECTED DRAWING: None

Inventors:
Hiroshi Kasai
Application Number:
JP2017147047A
Publication Date:
August 18, 2023
Filing Date:
July 28, 2017
Export Citation:
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Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
C08F8/00; C08F290/12
Domestic Patent References:
JP2000292923A
Foreign References:
KR1020160060410B1
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office