Title:
クランプ装置及びこれを有するミクロトーム
Document Type and Number:
Japanese Patent JP7352470
Kind Code:
B2
Abstract:
A clamping device includes: an operating member; a wedge having a first inclined surface; a clamping member having a second inclined surface movable relative to the first inclined surface, the first and second inclined surfaces being provided in a face-to-face arrangement; and a housing having a first guiding part, a second guiding part and a chamber. The operating member is mounted in the first guiding part, the clamping member is mounted in the second guiding part, and the wedge is disposed in the chamber; the operating member is operated to move towards the wedge, such that the operating member contacts and pushes the wedge to move, and further the first inclined surface contacts and moves along the second inclined surface; whereby a pushing force of the operating member in a first direction is converted into a clamping force of the clamping member in a second direction.
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Inventors:
Fan, Zeguan
Hao, Shanyu
Jean, Shaoki
Hao, Shanyu
Jean, Shaoki
Application Number:
JP2019559029A
Publication Date:
September 28, 2023
Filing Date:
April 11, 2018
Export Citation:
Assignee:
Leica Microsystems Ltd. Shanghai
International Classes:
G01N1/06
Domestic Patent References:
| JP6053831A | ||||
| JP588539U | ||||
| JP6049108A | ||||
| JP54102571U |
Foreign References:
| CN103481077A |
Attorney, Agent or Firm:
Asamichi Kato
Kiyoto Uchida
Kiyoto Uchida