Title:
多層構造体及びそれを用いた回収方法
Document Type and Number:
Japanese Patent JP7356841
Kind Code:
B2
Abstract:
To provide a multilayer structure that prevents thermal degradation of a resin caused by melt molding in recovery and reuse and has excellent quality stability in repeated recovery and reuse, high mechanical strength such as piercing strength, and a good appearance after heat treatment.SOLUTION: A multilayer structure includes at least a layer (A) having a polybutylene telephthalate resin (a) as the main component, a layer (B) having a polyolefin resin (b) as the main component, an adhesive resin layer (C), and a barrier layer (D). The layer (A) has an elastic modulus of 2.5 GPa or more. Every resin that is the main component of each layer has a melting point of 230°C or lower. The ratio (Xa/Xb) of Xa to Xb is 0.50-1.00, where Xa is smaller one of breaking elongations of two orthogonal directions and Xb is larger one.SELECTED DRAWING: None
Inventors:
Makoto Suzuki
Application Number:
JP2019141735A
Publication Date:
October 05, 2023
Filing Date:
July 31, 2019
Export Citation:
Assignee:
KURARAY CO.,LTD.
International Classes:
B32B27/32; B32B27/00; B32B27/36; B65D65/40
Domestic Patent References:
| JP2013256047A | ||||
| JP2015083665A | ||||
| JP2018053949A | ||||
| JP2004099784A |
Attorney, Agent or Firm:
Setouchi International Patent Office