Title:
オーバーレイ計測システム用の自動レシピ最適化
Document Type and Number:
Japanese Patent JP7369851
Kind Code:
B2
Abstract:
An overlay metrology system is disclosed. The overlay metrology system includes a controller configured to be communicatively coupled with an overlay metrology subsystem. The controller receives overlay measurements from the overlay metrology subsystem and generates one or more quality metrics. The controller extracts a set of principle components from the one or more quality metrics. The controller generates input data and inputs the input data into an input matrix of a supervised machine learning algorithm to train a predictive model. The controller then identifies a recipe or hardware configuration with a minimum residual value.
Inventors:
Li Weihua
way simin
way simin
Application Number:
JP2022503926A
Publication Date:
October 26, 2023
Filing Date:
July 20, 2020
Export Citation:
Assignee:
KLA Corporation
International Classes:
H01L21/66; G01B21/00; G03F7/20
Domestic Patent References:
| JP2017536584A |
Foreign References:
| US20150323316 | ||||
| US20060064280 | ||||
| WO2018072980A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation YKI International Patent Office