Title:
研磨用組成物、研磨方法および半導体基板の製造方法
Document Type and Number:
Japanese Patent JP7398304
Kind Code:
B2
Abstract:
A polishing composition according to the present invention contains abrasive grains, a basic inorganic compound, an anionic water-soluble polymer, and a dispersing medium, in which a zeta potential of the abrasive grains is negative, an aspect ratio of the abrasive grains is 1.1 or less, in a particle size distribution of the abrasive grains obtained by a laser diffraction/scattering method, a ratio D90/D50 of a particle diameter D90 when an integrated particle mass reaches 90% of a total particle mass from a fine particle side to a particle diameter D50 when the integrated particle mass reaches 50% of the total particle mass from the fine particle side is more than 1.3, and the basic inorganic compound is an alkali metal salt.
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Inventors:
Mae Ryota
Application Number:
JP2020049621A
Publication Date:
December 14, 2023
Filing Date:
March 19, 2020
Export Citation:
Assignee:
Fujimi Incorporated Co., Ltd.
International Classes:
C09K3/14; B24B37/00; C01F7/42; H01L21/304
Domestic Patent References:
| JP2017101248A | ||||
| JP2001323254A | ||||
| JP2016056292A | ||||
| JP2002523327A |
Foreign References:
| WO2016132676A1 | ||||
| WO2015019888A1 |
Attorney, Agent or Firm:
IBC Ichibancho Patent Attorney Corporation