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Title:
樹脂製品
Document Type and Number:
Japanese Patent JP7402526
Kind Code:
B2
Abstract:
To provide a resin product incorporating an RFID which can repeatedly and stably be used under a circumstance of high temperature, high pressure, and high humidity similar to those of high pressure steam sterilization.SOLUTION: An RFID 2 is fixed in a case 5 having no lid for positioning in a state in which its surroundings is covered by a heat insulating protective layer 6. Then, a resin product 8 is formed by integrally molding the RFID partially covered with the heat insulating protective layer in the case by resin which has heat distortion temperature of 240°C or higher and which covers them.SELECTED DRAWING: Figure 6

Inventors:
Takahiro Kajiyama
Homare Hashimoto
Juei Furuya
Application Number:
JP2021074587A
Publication Date:
December 21, 2023
Filing Date:
April 27, 2021
Export Citation:
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Assignee:
Nissei Sangyo Co., Ltd.
International Classes:
G06K19/077; A61B17/28; A61B17/30; B29C33/14; G06K19/02
Domestic Patent References:
JP2008009883A
JP2014026447A
Foreign References:
WO2021044930A1
US20060244652
WO2014017530A1
US20060043178
Attorney, Agent or Firm:
Masatoshi Iwane



 
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