Title:
樹脂成形装置、樹脂成形品の製造方法
Document Type and Number:
Japanese Patent JP7417429
Kind Code:
B2
Abstract:
Provided are a resin molding device capable of conveying a release film supplied with a low-viscosity liquid resin to a mold, and a method for manufacturing a resin molded product. The resin molding device includes: a mold including an upper mold and a lower mold opposing the upper mold; a mold coupling device for coupling the mold; a film adsorption band which adsorbs the release film and has an upper surface that is lower in the center than the outer periphery; a resin discharge unit for discharging a liquid resin to the release film; and a chamber unit constituting the upper and side surfaces of a chamber disposed on the lower surface of the release film.
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Inventors:
Tomoyuki Goto
Application Number:
JP2020006406A
Publication Date:
January 18, 2024
Filing Date:
January 17, 2020
Export Citation:
Assignee:
towa corporation
International Classes:
B29C43/18; H01L21/56
Domestic Patent References:
| JP2004148621A |