Title:
レーザ加工システムのためのフレーム及び外側シュラウド
Document Type and Number:
Japanese Patent JP7422146
Kind Code:
B2
Abstract:
A frame for a laser processing module can be characterized as including a platform having an upper surface and a lower surface, an optics bridge spaced apart from, and extending over, the upper surface of the platform and a bridge support interposed between, and coupled to, the platform and the optics bridge. At least one selected from the group consisting of the platform and the optics bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to one another by the core and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second port formed at the exterior of the sandwich panel and in fluid communication with the at least one channel.
Inventors:
Corey Newfeld
Willie, Jeremy
Bill You, Brandon
Closer, wayne
Rider, chris
Willie, Jeremy
Bill You, Brandon
Closer, wayne
Rider, chris
Application Number:
JP2021520929A
Publication Date:
January 25, 2024
Filing Date:
October 15, 2019
Export Citation:
Assignee:
Electro Scientific Industries, Inc.
International Classes:
B23K26/70; B23Q1/01; B23Q11/08
Domestic Patent References:
| JP2011155167A | ||||
| JP60114431A | ||||
| JP2011255472A |
Foreign References:
| CN204522064U | ||||
| US5626157 | ||||
| US20100089880 |
Attorney, Agent or Firm:
Tomohiro Mori