Title:
銅めっき廃液からの銅析出法およびそれを用いた銅分離回収装置
Document Type and Number:
Japanese Patent JP7441056
Kind Code:
B2
Abstract:
To increase the content of copper obtained at inexpensive treatment costs in a method for depositing copper from electroless plating liquid and an apparatus for separating and recovering copper using the method.SOLUTION: A method for depositing copper from copper plating liquid, is characterized in that: NaBH4 is added to copper plating liquid to form copper fine particles as a core; copper is deposited on the copper fine particles by the action of HCHO in the copper plating liquid to form copper particles; and copper is additionally deposited on the copper particles by the action of HCOONa produced in the reaction of depositing copper to form copper particles. An apparatus for separating and recovering copper is constituted of: a copper plating tank for storing copper plating liquid; an NaBH4 tank for storing NaBH4; an NaBH4 mixing tank in which copper plating liquid supplied from the copper plating tank is mixed with NaBH4 supplied from the NaBH4 tank, and copper is deposited in accordance with the above copper deposition method; a solid-liquid separator for recovering copper by performing the solid-liquid separation of the copper-containing treated liquid supplied from the NaBH4 mixing tank; and a control unit for controlling the operation of the copper plating tank, the NaBH4 tank, the NaBH4 mixing tank and the solid-liquid separator.SELECTED DRAWING: Figure 1
Inventors:
Masahiro Nagase
Yasutaka Kato
Yasutaka Kato
Application Number:
JP2020009668A
Publication Date:
February 29, 2024
Filing Date:
January 24, 2020
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
C02F1/62; C02F1/70; C23C18/16
Domestic Patent References:
| JP2152592A | ||||
| JP61074696A | ||||
| JP51139167A | ||||
| JP2014012880A | ||||
| JP2009256779A | ||||
| JP2010174312A | ||||
| JP59101444A | ||||
| JP2017538040A |
Attorney, Agent or Firm:
Patent Attorney Ginza Maronnier Patent Office