Title:
基板処理装置
Document Type and Number:
Japanese Patent JP7441666
Kind Code:
B2
Abstract:
To provide a substrate processing apparatus capable of appropriately processing a substrate even when the viscosity of treatment liquid is high.SOLUTION: A coating unit 40 and a liquid feeding unit 32 are housed in a lower processing chamber 121. A space in the lower processing chamber 121 is divided into a lower space R1 and an upper space R2 by a partition wall 123. The liquid feeding unit 32 is arranged in the lower space R1 of the lower processing chamber 121, and the coating unit 40 is arranged in the upper space R2 of the lower processing chamber 121. Treatment liquid is sent to the coating unit 40 through a flow path by the liquid feeding unit 32. A substrate W is processed by the coating unit 40 using the treatment liquid by the liquid feeding unit 32.SELECTED DRAWING: Figure 2
Inventors:
Seiji Murai
Kazuo Morioka
Masaru Kanaoka
Satoshi Yamamoto
Yoshinori Furukata
Kazuo Morioka
Masaru Kanaoka
Satoshi Yamamoto
Yoshinori Furukata
Application Number:
JP2020020876A
Publication Date:
March 01, 2024
Filing Date:
February 10, 2020
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/027; B05C11/08
Domestic Patent References:
| JP2001340800A | ||||
| JP2008251890A | ||||
| JP2000173902A | ||||
| JP2019169681A | ||||
| JP2008085263A | ||||
| JP6216017A | ||||
| JP2003071367A | ||||
| JP2017076670A |
Attorney, Agent or Firm:
Masahiro Nakagawa
Yoshito Fukushima
Go Sakane
Hideyuki Sawamura
Yoshito Fukushima
Go Sakane
Hideyuki Sawamura