Title:
処理液、基板の処理方法
Document Type and Number:
Japanese Patent JP7449391
Kind Code:
B2
Abstract:
An object of the present invention to provide a treatment liquid for a semiconductor device, where the treatment liquid has an excellent corrosion prevention property with respect to a metal-containing layer and excellent removability of an object to be removed, and also has excellent solubility in a post-treatment liquid. In addition, an object of the present invention is to provide a substrate treatment method using the treatment liquid.The treatment liquid of the present invention is a treatment liquid for a semiconductor device, which contains water, a removing agent, and a copolymer, and the copolymer has a first repeating unit having at least one group selected from the group consisting of a primary amino group, a secondary amino group, a tertiary amino group, and a quaternary ammonium cation, and a second repeating unit different from the first repeating unit.
Inventors:
Tomoe Takahashi
Yasuo Sugishima
Atsushi Mizutani
Yasuo Sugishima
Atsushi Mizutani
Application Number:
JP2022544481A
Publication Date:
March 13, 2024
Filing Date:
August 18, 2021
Export Citation:
Assignee:
Fujifilm Corporation
International Classes:
H01L21/304; C11D1/04; C11D1/06; C11D1/12; C11D1/29; C11D1/34; C11D3/04; C11D3/06; C11D3/20; C11D3/26; C11D3/28; C11D3/30; C11D3/34; C11D3/36; C11D3/37; C11D3/39; C11D3/43; C11D7/06; C11D7/08; C11D7/10; C11D7/16; C11D7/18; C11D7/22; C11D7/26; C11D7/28; C11D7/32; C11D7/34; C11D7/36; C11D7/38; C11D7/50; C11D17/08
Domestic Patent References:
| JP2019156990A | ||||
| JP2008020746A | ||||
| JP2019039027A | ||||
| JP2017150069A | ||||
| JP2014142635A |
Foreign References:
| WO2018163781A1 | ||||
| WO2018021038A1 | ||||
| WO2019138814A1 |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mihashi
Fumio Mihashi