Title:
温度制御システム及び基板処理システム
Document Type and Number:
Japanese Patent JP7450087
Kind Code:
B2
Abstract:
A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.
Inventors:
Misho Kaneko
Takehiko Arita
Hayato Sakai
Takehiko Arita
Hayato Sakai
Application Number:
JP2023076461A
Publication Date:
March 14, 2024
Filing Date:
May 08, 2023
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; C23C14/50; C23C14/54; C23C16/46; C23C16/52; H01L21/31
Domestic Patent References:
| JP2019024055A | ||||
| JP2005210080A | ||||
| JP6174388A | ||||
| JP2017059568A |
Attorney, Agent or Firm:
Tetsuo Kanemoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine