Document Type and Number:
Japanese Patent JPH0131469
Kind Code:
B2
More Like This:
| JP2001508019 | [Title of Invention] Boron Nitride Packing Mold |
| JPS59128264 | FLEXIBLE CERAMIC FORMED BODY |
| JPS63129058 | BINDER FOR MONOLITHIC REFRACTORIES |
Inventors:
ROI CHESUTAA FUIIGIN
Application Number:
JP8504482A
Publication Date:
June 26, 1989
Filing Date:
May 21, 1982
Export Citation:
Assignee:
REMETSUTO CORP
International Classes:
C04B35/63; C04B35/00
Next Patent: JPH0131470