Japanese Patent JPH0331726

B2

A curable resinous composition comprising:(A) an organic elastomeric polymer having at least one silicon-containing reactive group in a molecule,(B) an epoxy resin,(C) a silicone compound having a silicon-containing group and a functional group reactive with an epoxy group, and(D) a curing agent for the epoxy resin, wherein said silicon-containing reactive group is a group of the formula:wherein X is a hydroxyl group or a hydrolyzable group, R₁ is a monovalent hydrocarbon group having 1 to 20 carbon atoms or an organosiloxy group, "a" is 0, 1, 2 or 3, "b" is 0, 1 or 2 provided that the total of "a" and "b" is at least 1, and "m" is 0 or an integer of 1 to 18, a weight ratio of (A) to (B) being from 1:100 to 100:1 and a weight ratio of (A) + (B) to (C) being from 100:0.1 to 100:20.

ISAYAMA KATSUHIKO
HIROSE TOSHIBUMI
IWAHARA TAKANAO
KAWAKUBO FUMIO

JP29631385A

May 08, 1991

December 25, 1985

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KANEGAFUCHI CHEMICAL IND

C08G59/00; C08G59/18; C08G59/40; C08G59/68; C08L43/04; C08L63/00; C08L83/10

Next Patent: JPH0331727