Title:
【発明の名称】電子装置のコンピュータ断層検査
Document Type and Number:
Japanese Patent JPH03500580
Kind Code:
A
Abstract:
Computed tomography inspection apparatus and method of inspecting electronic devices and features of PCBs/PWBs, such as solder bonds, tracings and vias. The system scans radiation passed through the devices in thin slices and detects attenuated radiation from which it generates data representing slice images with high resolution. The detected image data are analyzed automatically by an image data analyzer which receives model data against which it compares and evaluates the detected image data.
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Inventors:
Armisted, Robert A.
Application Number:
JP50585189A
Publication Date:
February 07, 1991
Filing Date:
April 18, 1989
Export Citation:
Assignee:
Advanced Research and Applications Corporation
International Classes:
G01B15/00; G01N23/04; H05G1/60; (IPC1-7): G01B15/00
Domestic Patent References:
| JPS6336137A | 1988-02-16 | |||
| JPS61213755A | 1986-09-22 | |||
| JPS6267432A | 1987-03-27 | |||
| JPS60161551A | 1985-08-23 |
Attorney, Agent or Firm:
Masaki Yamakawa (3 outside)