Title:
【発明の名称】スルーホールめっき印刷回路基板の製造方法
Document Type and Number:
Japanese Patent JPH03504061
Kind Code:
A
Abstract:
The process for manufacturing through-hole contacting plated printed circuit boards by direct metal electrodeposition on catalytically activated surfaces of the substrate material is improved by pre-treatment prior to electrodepositing the metal, preferably with a solution containing one or more nitrogen-containing organic compounds.
Inventors:
Houpe, Jurgen
Ivan, Herbert
Ivan, Herbert
Application Number:
JP50032688A
Publication Date:
September 05, 1991
Filing Date:
December 07, 1988
Export Citation:
Assignee:
Brasberg Oberflechen Technik GM BAH
International Classes:
C25D5/56; C25D5/54; H05K3/18; H05K3/42; (IPC1-7): C25D5/56; H05K3/42
Attorney, Agent or Firm:
Yanagawa Yasuo