Title:
【発明の名称】無電解銅被覆の間に形成される銅粒子の溶解方法
Document Type and Number:
Japanese Patent JPH03506052
Kind Code:
A
Abstract:
Non-adherent copper metal particles ("fines") formed in a plating bath during the course of autocatalytic electroless copper deposition onto activated substrate surfaces are oxidized and redissolved in the bath by brief application of current between an anode element and a cathode element immersed in the bath, the anode element being comprised of an anode surface substantially parallel and proximate to the bottom surface of the vessel containing the bath.
Inventors:
Kukankis, Peter Yee
Letteric, richard sea
Letteric, richard sea
Application Number:
JP50722890A
Publication Date:
December 26, 1991
Filing Date:
January 23, 1990
Export Citation:
Assignee:
MACDERMID,INCORPORATED
International Classes:
C23C18/38; C23C18/31; C23C18/40; (IPC1-7): C23C18/38
Attorney, Agent or Firm:
Takehiko Saito (2 outside)