Title:
【考案の名称】リードフレーム及びこれを利用した半導体装置
Document Type and Number:
Japanese Patent JPH04127659
Kind Code:
U
More Like This:
Inventors:
Hosoki Mitsuru
Application Number:
JP3150991U
Publication Date:
November 20, 1992
Filing Date:
May 09, 1991
Export Citation:
International Classes:
H01L23/48; (IPC1-7): H01L23/48