Document Type and Number:
Japanese Patent JPH0426797
Kind Code:
B2
Abstract:
A method of providing improved electrical and physical connections between the electrically conducting terminals (40) of an electronic component (100) and the conductors (12) of a printed circuit board (10) by utilising a high temperature solder material formed in mounds (20,22) on defined areas of the conductors, coating the mounds (20,22) with low temperature solder paste (30) and mating the terminals (40) of the component to the mounds (20,22) by forcing them through the low temperature solder coatings (30) prior to reflowing and cooling the low temperature solder.
Inventors:
JEI DEABISU BEIKAA
Application Number:
JP266588A
Publication Date:
May 08, 1992
Filing Date:
January 11, 1988
Export Citation:
Assignee:
FORD MOTOR CO
International Classes:
B23K1/00; B23K1/20; B23K35/26; H01R43/20; H05K3/34; H01R43/02
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