Document Type and Number:
Japanese Patent JPH0458539
Kind Code:
U
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Application Number:
JP10054790U
Publication Date:
May 20, 1992
Filing Date:
September 26, 1990
Export Citation:
International Classes:
B41F16/00; B41J13/00; B65H3/24; (IPC1-7): B65H3/24; B41F16/00; B41J13/00
Next Patent: SEALING METAL MOLD FOR SEMICONDUCTOR DEVICE