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Title:
【考案の名称】電子部品実装モールド回路基板
Document Type and Number:
Japanese Patent JPH0541179
Kind Code:
U
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Inventors:
Kazuo Miyajima
Tomoyuki Yamai
Application Number:
JP9903091U
Publication Date:
June 01, 1993
Filing Date:
November 06, 1991
Export Citation:
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Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H05K1/18; (IPC1-7): H05K1/18
Attorney, Agent or Firm:
Hiroshi Wakabayashi



 
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