Title:
【発明の名称】ウエーハの動的な気相処理および粒子気化を備える半導体製造装置
Document Type and Number:
Japanese Patent JPH05507389
Kind Code:
A
Abstract:
Apparatus for improved processing of semiconductor wafers and the like has at least one processing bowl, a chemical supply for supplying a processing chemical to the processing bowl, and at least one processing head mounted for controlled movement between a processing position in which the processing head is in an operative relationship with the processing bowl to define a substantially enclosed processing chamber, and a loading position in which the processing head is removed from the processing bowl for loading or unloading wafers from the processing head. A wafer support detachably supports wafers and allows controlled motion of the wafer support and any wafer held therein, at least when the processing head is in the processing position. The apparatus also includes a second processing chamber and a wafer transfer for moving wafers to and from the processing bowl, and to and from said second processing chamber.
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Inventors:
Bergman, Eric Jay
Reardon, Timothy Jay
Thompson, Raymon Eff
Alexander, Alexander
Reardon, Timothy Jay
Thompson, Raymon Eff
Alexander, Alexander
Application Number:
JP51015091A
Publication Date:
October 21, 1993
Filing Date:
April 19, 1991
Export Citation:
Assignee:
Semitour Incorporated
International Classes:
H01L21/302; H01L21/00; H01L21/687; G11B7/26; (IPC1-7): H01L21/302
Attorney, Agent or Firm:
Kyozo Yuasa (6 people outside)