Document Type and Number:
Japanese Patent JPH0552163
Kind Code:
B2
Abstract:
A hollow wafer which is made from a flat baked wafer cake is treated, particularly by roll- or brush-coating on at least one surface with a food-grade substance, such as fat or oil, to prevent ingress of moisture, and then while it is still soft and deformable after the baking operation, is wound to form the hollow wafer, particularly a wafer cone. Alternatively, the treatment may be performed during the winding of the wafer cake. The process is carried out by an applicator roller (7) or applicator brush, which engages with one side of the flat wafer cake on the opened baking tong (3), the roller (7) being supplied with fat or oil by pick up roller (6) and reservoir (5). Two applicators may be used to apply substances at different temperatures.
Inventors:
FURANTSU HAASU ZEENIORU
FURANTSU HAASU YUNIOORU
YOHAN HAASU
FURANTSU HAASU YUNIOORU
YOHAN HAASU
Application Number:
JP27263185A
Publication Date:
August 04, 1993
Filing Date:
December 05, 1985
Export Citation:
Assignee:
HAAS FRANZ WAFFELMASCH
International Classes:
A21B5/02; A21C15/00; A21C15/02; A21D8/00; A21B1/42; A21D8/06; A21D13/08; A21D15/08; (IPC1-7): A21D8/06; A21D15/08; A21D13/08; A21B5/02
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