Title:
【発明の名称】回路、例えば自動車のエヤーバックの制御回路用の高周波を遮蔽するケーシング
Document Type and Number:
Japanese Patent JPH06504162
Kind Code:
A
Abstract:
PCT No. PCT/EP91/02282 Sec. 371 Date Apr. 22, 1993 Sec. 102(e) Date Apr. 22, 1993 PCT Filed Dec. 3, 1991 PCT Pub. No. WO92/11745 PCT Pub. Date Jul. 9, 1992.An RF-shielding multicomponent metallic or metal-coated circuit housing (W, D) contains a printed circuit board (L), and a plug (S) which is connected to plug terminals (P) provided in the printed circuit board (L). A housing section (W) has a bay (E/B) which has metallic or metal-coated walls (B) which are at housing potential in the assembled state of the housing (W, D) and in which (E/B) the plug (S) is mounted. The bay (E/B) is open at one side face (M), the "open side face" (M), facing the inside (Q) of the housing, the bay (E/B) having edges (C) situated in a single plane and facing the open side face. The open side face (M) is covered by the printed circuit board (L) in the assembled state of the housing (W, D). The printed circuit board (L) is coated over a large area of its section (M) facing the bay (E/B) with a conducting layer (M) in such a way that strips of said layer (M) rest on the edges (C) in the assembled state of the housing (W, D) so that the layer (M) covers the bay (E/B) and the layer (M) is then at housing potential.
Inventors:
Plankle, christian
Groover, robert
Deer Maier, Joseph
Groover, robert
Deer Maier, Joseph
Application Number:
JP51869691A
Publication Date:
May 12, 1994
Filing Date:
December 03, 1991
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
B60R21/16; B60R21/00; H01R13/646; H01R13/658; H01R13/6581; H01R13/6594; H05K5/00; H05K9/00; (IPC1-7): H05K9/00; H01R13/658
Attorney, Agent or Firm:
Honda Takashi