Title:
【発明の名称】難燃性エポキシ成形材料と、素子封入方法と、封入された素子
Document Type and Number:
Japanese Patent JPH06508857
Kind Code:
A
Abstract:
A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulated the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.
Inventors:
Gallo, Antony, A.
Application Number:
JP51758191A
Publication Date:
October 06, 1994
Filing Date:
September 27, 1991
Export Citation:
Assignee:
Dexter Electronic Material Division of Dexter Corporation
International Classes:
C08G59/42; C08G59/30; C08G59/62; C08K3/16; C08K3/22; C08K3/26; C08K13/02; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/42; C08G59/62; C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Takashi Koshiba