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Title:
【考案の名称】セラミックス多層回路基板
Document Type and Number:
Japanese Patent JPH0652170
Kind Code:
U
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Inventors:
Fujii Masafumi
Application Number:
JP8636592U
Publication Date:
July 15, 1994
Filing Date:
December 16, 1992
Export Citation:
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Assignee:
SUMITOMO METAL INDUSTRIES,LTD.
International Classes:
H01L23/12; H05K1/02; H05K3/46; (IPC1-7): H05K3/46; H01L23/12; H05K1/02
Attorney, Agent or Firm:
Ryuji Inouchi



 
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