Title:
【発明の名称】配線基板に電子部品を搭載する方法と回路基板
Document Type and Number:
Japanese Patent JPH07105587
Kind Code:
B2
Abstract:
PURPOSE:To prevent the solder bridge between electronic components by flow soldering even if electronic components are mounted adjacently at narrow intervals by soaking the component mounted face of a substrate in fused solder and pulling it up after temporarily fixing electronic components and bringing the summit parts of electronic components into contact with a resin solution so as to apply and solidify resin in a crown shape or headband shape. CONSTITUTION:Electronic components 2, for example, cylindrical chip capacitors are temporarily fixed onto the conductor lands 4 of a wiring board 1 by potting, and then the summit parts of the cylindrical chip capacitors mounted are brought into contact with a resin solution so as to cover the whole summit parts including one part each of the electrodes 3 for connection of the capacitors with insulating resin 5 in a crown shape and solidify them. Next, the wiring board is soaked in a fused solder solution and then it is pulled up to form solder part 6 at one part each of the conductor land 4 and the electrode 3 for connection, thus the electronic components are mounted on the wiring board.
Inventors:
Akinaga Masanobu
Application Number:
JP12035690A
Publication Date:
November 13, 1995
Filing Date:
May 10, 1990
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H05K3/28; H05K1/18; H05K3/34; H05K3/30; (IPC1-7): H05K3/34; H05K1/18
Domestic Patent References:
| JP63263798A |
Attorney, Agent or Firm:
Maruoka Masahiko
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