Title:
【発明の名称】半導体ウエハの熱処理装置
Document Type and Number:
Japanese Patent JPH0727874
Kind Code:
B2
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Inventors:
Shigekazu Koeda
Takeo Tanaka
Tetsuya Takagaki
Takeo Tanaka
Tetsuya Takagaki
Application Number:
JP27284884A
Publication Date:
March 29, 1995
Filing Date:
December 26, 1984
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/22; H01L21/324; (IPC1-7): H01L21/22
Domestic Patent References:
| JP6095917A | ||||
| JP6079729A | ||||
| JP59143042U |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)
Next Patent: TIMEPIECE