Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JPH0783070
Kind Code:
B2
Abstract:
A semiconductor chip (3) is mounted on the upper surface of a metal package base (1), the space region above the semiconductor chip is covered and air-tightly sealed by a metal cover plate. An electrically insulating layer (13,15) is provided on the bottom surface of the package base and/or entire outer surface of the metal cover.
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Inventors:
Hideo Taguchi
Shindo Masamichi
Sakurai Juharu
Nobu Izawa
Junichi Ohno
Hiroyuki Takase
Shindo Masamichi
Sakurai Juharu
Nobu Izawa
Junichi Ohno
Hiroyuki Takase
Application Number:
JP3903488A
Publication Date:
September 06, 1995
Filing Date:
February 22, 1988
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L23/12; H01L23/02; H01L23/04; H01L23/10; H01L23/14; (IPC1-7): H01L23/12; H01L23/04
Domestic Patent References:
| JP5227374A | ||||
| JP6175548A |
Attorney, Agent or Firm:
Kazuo Sato (2 outside)
Next Patent: METHOD FOR COOLING ROTOR OF PRESSURE WAVE MACHINE