【発明の名称】半導体集積回路とその製造方法

Title:

【発明の名称】半導体集積回路とその製造方法

Document Type and Number:

Japanese Patent JPH0821582

Kind Code:

B2

Inventors:

SADAKATA TOSHIMASA
HATSUYA AKIRA

Application Number:

JP10910290A

Publication Date:

March 04, 1996

Filing Date:

April 25, 1990

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Assignee:

SANYO DENKI KK

International Classes:

H01L29/73; H01L21/3205; H01L21/331; H01L21/768; H01L21/8249; H01L23/522; H01L27/06; H01L29/732; (IPC1-7): H01L21/3205; H01L21/8249; H01L27/06

Domestic Patent References:

JP228923A
JP6329517A
JP63202939A

Attorney, Agent or Firm:

Koji Yasutomi (1 person outside)

Next Patent: 半導体集積回路の製造方法