Title:
【発明の名称】硬化中に低いピーク発熱を有する硬化可能なエポキシビニルエステル組成物又はポリエステル組成物
Document Type and Number:
Japanese Patent JPH08500146
Kind Code:
A
Abstract:
The invention is a curable resin composition comprising A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent; and D) a copper salt or complex of copper with an alcohol, aldehyde or ketone; and E) an inhibitor comprising alkylated phenolic compound or polyhydroxy aromatic compound. In another aspect it is a resin system comprising I) a resin composition comprising: A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent comprising a polar or aromatic ring containing compound; D) a copper salt or a copper complex with an alcohol, ketone or aldehyde; and E) an inhibitor comprising alkylated phenolic compound or a polyhydroxy aromatic hydrocarbon and I) a catalyst system which comprises E) an additional amount of an inhibitor; F) optionally an aliphatic amine, an aromatic amine, or a heterocyclic amine; G) a peroxide or persulphate initiator; and H) a transition metal accelerator. In another embodiment the invention is a method of curing a curable resin composition which comprises contacting the resin composition (I) with a catalytic amount of the catalyst composition (II) optionally contacting the mixture with a reinforcing structure and allowing the composition to cure; under conditions such that the peak exotherm 100 grams of the reaction mass is from 40 C to 120 C and the cure time is from 30 to 120 minutes.
Inventors:
Kelly, Paul Patrick
Application Number:
JP50630694A
Publication Date:
January 09, 1996
Filing Date:
August 02, 1993
Export Citation:
Assignee:
The Dow Chemical Company
International Classes:
C08F283/01; C08F283/10; C08F290/00; C08F290/06; C08F4/40; C08F290/14; (IPC1-7): C08F283/01; C08F4/40; C08F290/06
Attorney, Agent or Firm:
Kyozo Yuasa (6 people outside)