Title:
【発明の名称】金又は金合金の析出のためのシアン化物不含の電気メッキ浴
Document Type and Number:
Japanese Patent JPH11513078
Kind Code:
A
Abstract:
PCT No. PCT/EP97/03903 Sec. 371 Date Jun. 2, 1998 Sec. 102(e) Date Jun. 2, 1998 PCT Filed Jul. 21, 1997 PCT Pub. No. WO98/03700 PCT Pub. Date Jan. 29, 1998Cyanide-free electroplating baths for deposition of gold and gold alloy coatings, using sulphurous gold complexes that are stable for a relatively long time, can be used with current density over 1 A/dm2 and are practically odor-free, are obtained when the sulphurous compounds used are mercaptosulfonic acids, dye sulfide sulfonic acids or salts thereof.
Inventors:
Werner Kuhn
Wolfgang Zilske
Wolfgang Zilske
Application Number:
JP50656798A
Publication Date:
November 09, 1999
Filing Date:
July 21, 1997
Export Citation:
Assignee:
Degussa Akchengezel Shaft
International Classes:
C25D3/48; C25D3/62; (IPC1-7): C25D3/48; C25D3/62
Attorney, Agent or Firm:
Toshio Yano (3 outside)