Title:
【発明の名称】加工品に延在する孔又は窪みを液状処理剤で処理するための方法と装置
Document Type and Number:
Japanese Patent JPH11515142
Kind Code:
A
Abstract:
The treatment, for example the cleaning of holes or recesses in workpieces, is problematic when the holes or recesses have an opening width of below 0.5 mm, and especially when the latter do not penetrate the workpiece (blind bores). In known methods, gas bubbles adhering to the side-walls of holes of this type cannot be removed or liquids situated within the holes cannot be effectively exchanged.With the method according to the invention an effective exchange of the liquid contained in the holes and situated outwith the holes is made possible. For this purpose the liquid treatment means is sprayed as a jet into the holes, said jet having a diameter which is smaller than that of the holes.Furthermore, a device is described for carrying out this method which is characterised by a nozzle with one or several nozzle discharge openings with a diameter below 0.5 mm, by a liquid supply unit by means of which liquid treatment medium is pumped through the nozzle discharge openings and by a filter unit, communicating with the openings and the feeder unit, for removing particles from the treatment medium.
Inventors:
Dust Franz
Bren Gunther
Schaefer Michael
Meyer Heinrich
Stroip Helibelt
Bren Gunther
Schaefer Michael
Meyer Heinrich
Stroip Helibelt
Application Number:
JP51231097A
Publication Date:
December 21, 1999
Filing Date:
September 06, 1996
Export Citation:
Assignee:
Atotehi Deutschland Gesellschaft Mitt Beschlenktel Haftung
International Classes:
B05D3/10; B08B3/02; B08B3/08; C25D5/08; C25D7/00; H05K3/00; H05K3/26; (IPC1-7): H05K3/26
Attorney, Agent or Firm:
Takehisa Ito (1 outside)