Document Type and Number:
Japanese Patent JPS4216653
Kind Code:
Y1
Application Number:
JP9638766U
Publication Date:
September 26, 1967
Filing Date:
October 17, 1966
Export Citation:
International Classes:
H01H13/12; (IPC1-7): H01H13/12
Previous Patent: 法面におけるポーラスコンクリートの打設工法およびそれに使用するプレ...
Next Patent: MANUFACTURE OF PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT
Next Patent: MANUFACTURE OF PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT