Document Type and Number:
Japanese Patent JPS4933565
Kind Code:
A
Abstract:
An automatic bonding apparatus for assembling semiconductor devices, said apparatus comprising a bonding arm carrying a capillary at one end and mounted on a pedestal swingably in a vertical plane, said pedestal being mounted on a base movably in a horizontal plane, horizontal driving cam means for driving said pedestal in the horizontal plane, vertical driving cam means for effecting swinging movement of said bonding arm, and synchronizing mechanism for determining the speed ratio of said horizontal driving cam means to said vertical driving cam means.
Application Number:
JP7418372A
Publication Date:
March 28, 1974
Filing Date:
July 26, 1972
Export Citation:
International Classes:
B23K20/00; H01L21/00; H01L21/60; (IPC1-7): H01R43/00