Login| Sign Up| Help| Contact|

Patent Searching and Data


Document Type and Number:
Japanese Patent JPS4989890
Kind Code:
A
More Like This:
JPH08172069SURFACE TREATMENT METHOD AND SEMICONDUCTOR MANUFACTURING DEVICE USING THE SAME
WO/2003/008658ITO SINTERED BODY SPUTTERING TARGET FOR FORMING HIGH−RESISTANCE FILM AND ITS MANUFACTURING METHOD
WO/2013/111681SUBSTRATE WITH TRANSPARENT ELECTRODE AND METHOD FOR PRODUCING SAME
Application Number:
JP115973A
Publication Date:
August 28, 1974
Filing Date:
December 29, 1972
Export Citation:
Click for automatic bibliography generation   Help
International Classes:
C23C14/58; C23C14/08; H01B13/00



 
Previous Patent: JPS4989889

Next Patent: 金属酸化物系蛍光体微粒子を利用した蛍光体及びその製造方法並びに蛍光...