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Document Type and Number:
Japanese Patent JPS5050450
Kind Code:
A
More Like This:
WO/2001/043727ELECTROSTATIC APPLICATION OF POWDER MATERIAL TO SOLID DOSAGE FORMS
JP3363467METHOD FOR BONDING INTEGRATED CIRCUIT PACKAGE
Application Number:
JP9923573A
Publication Date:
May 06, 1975
Filing Date:
September 05, 1973
Export Citation:
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International Classes:
B05B5/08; B05B5/12; B05D1/06; H01J9/20; H01K3/00; (IPC1-7): B05B5/02; H01J9/20
Domestic Patent References:
JPS4112227Y1
Foreign References:
US2806444A1957-09-17



 
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