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Document Type and Number:
Japanese Patent JPS5140870
Kind Code:
A
More Like This:
JP2004288834MOUNTING METHOD AND STRUCTURE FOR ELECTRONIC COMPONENT, AND PACKAGE BOARD
WO/2017/000852METHOD OF MANUFACTURING FAN-OUT WAFER-LEVEL PACKAGE
Inventors:
OKAMURA SHIMUYA
Application Number:
JP11388774A
Publication Date:
April 06, 1976
Filing Date:
October 04, 1974
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L21/56; H01L21/027; H01L21/302; H01L21/312; (IPC1-7): H01L21/302; H01L21/312



 
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