Document Type and Number:
Japanese Patent JPS5318702
Kind Code:
B2
Abstract:
A method of batch soldering components of hybrid circuits to substrates comprising advancing the substrates having mounted thereon solder paste layers or preforms on which the components are resting in unsoldered state, along a path which leads through a wave of hot, dense liquid, such that the substrates float free on the liquid wave for a period long enough to melt the solder paste or preform, and then moving the substrates out of contact with the liquid wave to cool the assemblies which now have the components soldered down to them.
Application Number:
JP12869773A
Publication Date:
June 16, 1978
Filing Date:
November 15, 1973
Export Citation:
International Classes:
B23K1/00; B23K1/08; H05K3/34; H05K1/03