Document Type and Number:
Japanese Patent JPS5335009
Kind Code:
B1
Abstract:
An improved process for coating a metal substrate with a metallic coating or an abrasive-filled metallic coating metallurgically bonded to the substrate comprising placing on a metal substrate a coating layer having a desired thickness said layer comprising a mixture of a powdered metal or alloy and a binder or a mixture of a powdered metal or alloy, powdered abrasive and a binder; contacting the metal substrate with an electrode connected to a source of high amperage electrical power; contacting, under moderate pressure, the coating layer with a second electrode also connected to said high amperage electrical source and for a short period of timg passing sufficient high amperage electrical current through the substrate and coating layer to decompose the binder and fuse the powdered metal or alloy. The process is useful for producing metallic articles having a corrosion or a wear-resistant coating.
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Application Number:
JP1930271A
Publication Date:
September 25, 1978
Filing Date:
April 01, 1971
Export Citation:
International Classes:
B23K20/227; B23K35/02; C23C24/10; (IPC1-7): C23C17/00