Document Type and Number:
Japanese Patent JPS5436832
Kind Code:
B2
Abstract:
PURPOSE:To make possible the assembly of a semi-conductor device with many bonding parts, and besides, in even assembling a semi-conductor with various items, to make it possible by simple adjustment.
Application Number:
JP8832775A
Publication Date:
November 12, 1979
Filing Date:
July 21, 1975
Export Citation:
International Classes:
B23K20/00; H01L21/60