Document Type and Number:
Japanese Patent JPS5440279
Kind Code:
B2
Abstract:
The curable composition provided by the present invention comprises a butadiene polymer having organosilicon groups as the pendant groups, an ethylenically unsaturated polymerizable compound, an organic peroxide, and optionally a filler. The butadiene polymer being the base of this composition can readily be obtained by the platinum-catalyzed addition reaction between an organosilicon compound having a hydrogen atom directly bonded to the silicon atom in a molecule and the ethylenic unsaturation of a conventional butadiene polymer.
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Application Number:
JP9889276A
Publication Date:
December 03, 1979
Filing Date:
August 19, 1976
Export Citation:
International Classes:
C08F8/00; C08C19/25; C08F8/42; C08F279/00; C08F279/02; C08F289/00; C08F290/00; C08F299/00; C08K5/14; C08L83/16