Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRICALLY CONDUCTIVE BONDING MATERIAL
Document Type and Number:
Japanese Patent JPS58103570
Kind Code:
A
Abstract:

PURPOSE: To provide an electrically conductive bonding material which has excellent electrical conductivity and can connect circuits with each other without necessity of soldering or screwing, by combining an electrically conductive part with an adhesive part while separating them from each other, and pressing said electrically conductive part against electrically conductive surfaces to be bonded to bond said electrically conductive part to said conductive surface by said adhesive part.

CONSTITUTION: Both sides of a foamed carrier sheet 1 having good resistance to heat and weather, such as neoprene foam, are coated with a pressure-sensitive adhesive 2 to obtain a double-side adhesive sheet 3. A through-hole 4 is provided at the central part of said sheet 3. An elastic electrical conductor 5 composed of phosphor bronze or beryllium copper is inserted into said through-hole 4 to obtain an electrically conductive bonding material. The adhesive part 2 of this bonding material is bonded to the adherend surfaces 6, 7 of a conductor to be bonded, whereby the elastic electrical conductor 5 is elastically bonded between the adherend surfaces 6, 7 by pressing.


Inventors:
NAKAMATSU YOSHIROU
Application Number:
JP20158381A
Publication Date:
June 20, 1983
Filing Date:
December 16, 1981
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NAKAMATSU YOSHIRO
International Classes:
C09J7/02; H01B5/14; H05K3/32; (IPC1-7): C09J7/02
Domestic Patent References:
JPS5048870U1975-05-14
JPS50117163U1975-09-25



 
Previous Patent: JPS58103569

Next Patent: JPS58103571