Title:
I/C CHIP
Document Type and Number:
Japanese Patent JPS58105554
Kind Code:
A
Abstract:
PURPOSE:To well connect the bump of finger lead to the pad of chip by entirely removing the protection film of junction pad region in the periphery of IC chip and providing the Au layer to the electrode surface of pad region through a base metal which is satisfactrily adhered thereto. CONSTITUTION:The SiO2 film 24 on the Al electrode surface 23 of the junction pad region in the periphery of IC chip is selectively removed by etching in order to form an Al exposed region 25. The area other than the region 25 is selectively covered with a resist 26, and Au which is well connected to the bump 29 of the finger lead (Cu-Sn or Sn-Au etc.) 28 of tape carrier is deposited at the upper most layer with a metal 27 such as Ti-Pt-Au or Ni-Pd-Au which shows well contactness with Al 23 used as the base metal. Then, the resist 26 is removed by the lift off method and a thin film laminated metal layer is left only on the surface of electrode 23. According to this structure, there is no protection film which may be adhered forming mound around the electrode 23 and the Au layer is formed as the upper most layer and therefore bump of finger lead is well connected to the junction pad 31 of IC chip.
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Inventors:
OOTA YUTAKA
OONO YASUO
OONO YASUO
Application Number:
JP20360681A
Publication Date:
June 23, 1983
Filing Date:
December 18, 1981
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60; H01L21/92
Domestic Patent References:
| JPS514391A | 1976-01-14 |
Attorney, Agent or Firm:
Hiroshi Kikuchi