PURPOSE: To provide a heat-curable water-dispersible coating compsn. capable of forming films excellent in physical properties such as resistance to impact, bending, etc., by blending particular synthetic resin particles holding a solid state even when heat-cured.
CONSTITUTION: 100pts.wt. (as solid) heat-curable film-forming resin compsn. comprising a water-sol. resin (e.g., acrylic resin with acod value of about 30W100 and hydroxyl value of about 20W200), a water-dispersible acrylic resin, and a crosslinker of said water-dispersible acrylic resin (e.g., amino resin) is mixed with 60pts.wt. or less synthetic resin particles, average particle size ≤50μ, holding a solid state even under conditions of heat-curing without compatibility with the above resin compsn. (e.g., particulate polyvinyl chloride) to allow to disperse.
SATOU TADAAKI
HIMOTO ISAO
IWAZAWA NAOZUMI
