Title:
CONTINUOUS HIGH SPEED PLATING DEVICE
Document Type and Number:
Japanese Patent JPS58147585
Kind Code:
A
Abstract:
PURPOSE:To reduce the treating time of continuous high speed plating and to obtain plated surface having high quality by disposing many treating cells for plating on a circular table in order of stages annularly, suspending bar-like blank materials on the outside circumference of a sub-table and turning the same dividely. CONSTITUTION:Pretreating tanks for degreasing, pickling, rinsing, etc., a copper plating cell, and tanks A1-A16 for post treatments as well as a work mounting position W1 and a removal position W2 are provided annularly on a circular stationary table 1. A sub-table is suspended above the table 1, and is turned and indexed by means of an index mechanism. Bar-like blank materials such as connecting rods are suspended by as much as the number of the treating cells and tanks on the outside circumference of the sub-table and the bottom end parts of the blank materials are so placed as to face the tanks A1-A16, etc. The blank materials are subjected to the cyclical motion of feeding the same from the position W1 to the next stages S1-S16, and the position W2 at every indexed turning of the sub-table. The holes opened in the end parts of the connecting rods of engines, etc. are plated with copper continuously ar a high speed with the above-mentioned device.
Inventors:
TAKEMURA KOUICHI
Application Number:
JP3113682A
Publication Date:
September 02, 1983
Filing Date:
February 27, 1982
Export Citation:
Assignee:
ENSHU SEISAKU KK
YAMAHA MOTOR CO LTD
YAMAHA MOTOR CO LTD
International Classes:
B65G49/04; B65G49/00; C25D5/02; C25D5/08; C25D7/04; C25D17/06; C25D19/00; (IPC1-7): B65G49/00; C25D5/08; C25D17/06; C25D19/00