Title:
【考案の名称】半導体の放熱板装置
Document Type and Number:
Japanese Patent JPS58153454
Kind Code:
U
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Inventors:
Kumano Masakazu
Application Number:
JP4887482U
Publication Date:
October 14, 1983
Filing Date:
April 06, 1982
Export Citation:
International Classes:
H05K7/20; H01L23/40; (IPC1-7): H01L23/40; H05K7/20