Title:
WIRING CONNECTION BY LASER BEAM
Document Type and Number:
Japanese Patent JPS58171834
Kind Code:
A
Abstract:
PURPOSE:To realize wiring connection with high quality and yield by changing the wiring portion to conductive condition from non-conductive condition through irradiation of laser beam after coating an insulating film on the surface. CONSTITUTION:The wiring portion insulated from a substrate 1 by the SiO2 film 2 deposited on the si substrate 1 is composed of low resistance layers 3, 4 and a high resistance layer 5, with formation of insulating films 8, 9, 10. In case of connecting this connecting portion, the laser beam is irradiated to the high resistance layer 5 and a part of the low resistance layers in both sides thereof, in view of changing the high resistance layer 5 to the low resistance layer. In the case of this invertion, laser beam is irradiated through insulating layer and therefore a wide laser power density range can be taken and connection with high yield can be realized.
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Inventors:
HONGOU MIKIO
MIYAUCHI TAKEOKI
KAWANABE TAKAO
MINATO OSAMU
MASUHARA TOSHIAKI
MIYAUCHI TAKEOKI
KAWANABE TAKAO
MINATO OSAMU
MASUHARA TOSHIAKI
Application Number:
JP5381882A
Publication Date:
October 08, 1983
Filing Date:
April 02, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/52; H01L21/3205; H01L21/82; (IPC1-7): H01L21/82
Attorney, Agent or Firm:
Katsuo Ogawa